Specifications:   1 Power consumption 3800W 2 Top Heater 800W 3 Bottom Heater 3000W 4 Power supply single-phase 220VAC    50/60Hz   3.8KVA 5 Machine Dimension 800×500×580mm 6 Positioning V-groove PCB positioning, Max PCB size: 450 × 400mm 7 Temperature control high-precision K Sensor,(closed-loop) 8 Weight of machine about 45kg Features: 1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely. 2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.  3. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.  4. Top & bottom heating can be controlled independently by the temperature graphs. A cross-flow fan cools rapidly to protect the PCB from deformation when welding. 5. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it. 6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering. 7. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB. 8. Lighting work to increase the brightness of the platform. 9. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.